This is just one facet of our "Time to Market" strategy. Years of cooperation with our worldwide assembly houses, combined with our own extensive know-how, guarantees the required resources for production capacity and future technologies.

The Package Capabilities of ams

Packaging technology is an integral part of the circuit design process. As a result of ASIC technology development, the need to accommodate high pin counts is more important than ever. SMD packages (chip carriers, flat packs) in particular are being used in a growing number of applications. Although plug-in packages (dual in-line packages) still have their applications.

The Packaging Solutions of ams

ams can provide you with the ultimate in compatibility with your integrated circuit's requirements and offers you package processes spanning a broad spectrum of capabilities. You can choose from more than 80 package types including technologies ranging from the traditional such as plastic and ceramic dual-in-line packages, to small outline ICs, quad flat packs, plastic and ceramic chip carriers, as well as ceramic pin grid arrays with up to 447 lead capability. The company's high reliability ceramic and plastic packages are renowned throughout the industry and are put to use in various areas such as the communications, automotive, and industrial markets. The variety of packages installed at the company is, while permanently being expanded, supplemented with a complete selection of advanced packages which the company procures from its qualified sub-contractors.