Meet with ams
We are presenting our latest innovations at the following international trade fairs, shows and conferences:
The International Consumer Electronics Show (International CES) is the world’s gathering place for all who thrive on the business of consumer technologies.
The VDI conference with focus on automotive board net development will take place in Leipzig from 14.01. – 15.01.2015. Experts are going to discuss future board net trends and will also portray the board net as an enabler for new automotive concepts and applications.
CarEle is referred to as Asia’s leading exhibition specialized in automotive electronics. A variety of automotive electronic technologies such as components, materials, software, manufacturing equipment and testing technologies are showcased there.
European 3D TSV Summit is a global event combining plenary sessions, roundtables, exhibition, and one on one business meeting service. Based on the theme "Enabling Smarter Systems" the event will present attendees with both the business and technological aspects of 2.5 / 3D Integration.
The European 3D TSV Summit will demonstrate the full range of 3D technology and R&D processes, with leading companies presenting an array of products and manufacturing techniques.
Mobile World Congress is the world’s largest annual gathering of mobile and related industry C-Level executives.