As part of the ASIC design, ams supports its customers in defining the most suitable package for optimal system solutions. ams partners with industry leading suppliers to offer a broad range of packaging options including wafer-level-chip-scale-package (WLCSP) and chip-on-flex (COF). For automotive applications, fully qualified plastic packages are available meeting high temperature requirements up to 150°C ambient and 175°C storage temperature.

We offer also dual die assembly for redundancy in safety critical applications.

To assure high product quality, the wafer- as well as the final test is performed in-house.