ams AG - global leader in the design and manufacture of high performance analog ICs (integrated circuits)
ams 회사 소개 투자자 연락처 뉴스룸 채용정보 Samples & Shop
/ 뉴스룸 / 최신 이벤트

최신 이벤트

ams는 아래와 같은 무역박람회, 세미나, 이벤트에서 만나볼 수 있습니다.

2014/11/04 - 2014/11/06 Paris, France

CARTES Secure Connexions Europe 2014

CARTES SECURE CONNEXIONS 2014 is the Global Event bringing together the world’s most comprehensive offer of solutions for payment, identification and mobility.

2014/11/06 Munich, Germany

Haus der Technik - Workshop

Thema: CO2-freie Stromerzeugung durch Abwärmenutzung

ams speaker slot @ 3pm

2014/11/11 - 2014/11/14 Germany

Electronica 2014

This is the world's leading trade fair for components, systems and applications. Meet decision-makers, developers and buyers. International trade fair with added value: The latest topics, trends and technologies - extensive range of services for a successful visit.

2014/11/18 - 2014/11/20 Germany

ID World

The Euro ID exhibition is the established meeting place for manufacturers, solution providers, distributors, system integrators, consultants and end-users of identification. As a part of the ID World Internation Congress ams has been named as the 2014 ID Award winner in the category of RFID Technologies & Applications. 

2014/12/11 - 2014/12/12 Nagoya, Japan

HITO (Human & Car Technology)

The largest Japanese technology exposition for automobile engineers where you will find the latest technology and products.

2014/11/25 - 2014/11/27 Germany

SPS Drive

SPS IPC Drives is Europe’s leading exhibition for electric automation.

2015/01/06 - 2015/01/09 Las Vegas, United States of America


The International Consumer Electronics Show (International CES) is the world’s gathering place for all who thrive on the business of consumer technologies.

2015/01/19 - 2015/01/21 Grenoble, France

European 3D TSV Summit 2015

European 3D TSV Summit is a global event combining plenary sessions, roundtables, exhibition, and one on one business meeting service. Based on the theme "Enabling Smarter Systems" the event will present attendees with both the business and technological aspects of 2.5 / 3D Integration.

The European 3D TSV Summit will demonstrate the full range of 3D technology and R&D processes, with leading companies presenting an array of products and manufacturing techniques.